MediaTek Dimensity 6100+: An Overview of the Mid-Range 5G Chipset

As of July 18, 2023, MediaTek has officially introduced the MediaTek Dimensity 6100+ system-on-chip (SoC) as part of its Dimensity series, catering to the mid-range 5G smartphone market. The Dimensity 6100+ SoC promises an array of premium features, including exceptional power efficiency, vibrant displays, high frame rates, AI-driven camera technologies, and reliable Sub-6 5G connectivity, all at an accessible price point.

The Dimensity 6100+ is the third member of the Dimensity 6000 series, succeeding the MediaTek Dimensity 6020 and Dimensity 6080 chips. It is built on a 6-nanometer process technology and features an octa-core CPU configuration. The CPU comprises two powerful Arm Cortex-A76 cores clocked at 2.2GHz for demanding tasks, while six Arm Cortex-A55 efficiency cores running at 2.0GHz handle less intensive processes, resulting in an optimized performance and power balance.

For graphics processing, the SoC is equipped with a Mali-G57 MC2 GPU, featuring a frequency of 950 MHz, 32 shading units, and 2 execution units, delivering up to 243 Gigaflops of computing power. This graphics capability allows for smooth visuals and a superior user experience, especially when paired with its support for 10-bit displays with refresh rates of up to 120Hz, ensuring smooth and immersive visuals.

The MediaTek Dimensity 6100+ also places a strong emphasis on photography. It supports camera setups with up to 108MP non-zero shutter lag (Non-ZSL) sensors and facilitates capturing videos in 2K resolution at 30 frames per second. Moreover, the SoC integrates AI-bokeh features for stunning portraits and selfies, enhancing the overall photography experience.

One of the standout features of this chipset is its focus on power efficiency. With UltraSave 3.0+ technology, the Dimensity 6100+ achieves a 20% reduction in 5G power consumption compared to rival solutions, contributing to prolonged battery life and increased efficiency.

Furthermore, the Dimensity 6100+ supports various connectivity options, including 2G, 3G, 4G, and 5G multi-mode networks, carrier aggregation (CA) for both 4G and 5G, and various global navigation satellite systems (GNSS) like GPS, Glonass, BeiDou, Galileo, QZSS, and NavIC.

As per MediaTek’s announcement, smartphones featuring the Dimensity 6100+ SoC are expected to hit the market in the third quarter of 2023. Device manufacturers are likely to leverage the chipset’s performance enhancements, power efficiency, and cost-effectiveness to create compelling offerings for mid-range consumers.

In conclusion, the MediaTek Dimensity 6100+ brings notable improvements to the mid-range 5G segment with its powerful CPU and GPU configuration, AI-driven camera capabilities, support for high refresh rate displays, and energy-efficient design. This chipset aims to enhance user experiences while keeping devices affordable for a broader audience. As more accurate data emerges with official releases, further updates will undoubtedly provide a comprehensive picture of the Dimensity 6100+’s capabilities and performance in real-world scenarios.